smd fyls ? 0603bugc-5 radiation pattern. features: z compatible with automatic placement equipment. z compatible with reflow solder process. applications: z automotive-telecommunication. z indicators. z lcd back-lights. z illuminations. descriptions: z dice material: algainp z emitting color: yellow green z lens color: water clear. absolute maximum ratings(ta=25 b ) parameter max. unit power dissipation 78 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 100 ma continuous forward current 30 ma derating linear from 25 0.4 ma/ operating temperature range -30 to +80 storage temperature range -40 to +85 electrical and optical characteristics(ta=25 b ) parameter symbol min. typ. max. unit test condition luminous intensity iv -- 11.5 -- mcd if=5ma viewing angle 2 1/2 - 130 - deg peak emission p 569 574 579 nm dominant wavelength d 570 575 580 nm spectral line half-width 15 20 25 nm forward voltage vf -- 1.9 2.3 v reverse current ir 10 a vr=5v relative lumionous intensity(lop @max=1)
smd typical electrical characteristics curves (25 b ambient temperature unless otherwise noted) ambient temperature ta( ) forward current vs forward voltage forward voltage(v) forward current derating curve forward current(ma) forward current(ma) luminous intensity vsambient temperature ambient temperature ta( ) c relative luminous intensity 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 10 0 20 30 40 50 (1) peak@574nm / green normalized response wave length(nm) spectral reduance 3.5 forward current if(ma) relative intensity (lop@20ma=1) relative luminous intensity vs forward current
smd ? precautions for use 1.suggest the leds should be kept between 5 and 30 and 60%rh or less before opening the package, the max. storage period before opening the package is 1 year. 2. after opening the package, the leds should be kept at 30 /35%rh or less, and it should be used within3 hours. in the event o f incomplete usage, it is advised that user preheat the remaining devices at 605 for 8 hours prior to use. 3. reflow soldering should not be done more t han twice. when soldering, don?t tress on leds during heating. after soldering, don?t warp the circuit board. 4. repair should not be done after the leds have been soldered. when repair is unavoidable, double-head soldering iro n should be used. it should be confirmed beforehand whether the characteristics of the leds will be damaged by repair or not. ? soldering iron: z temperature at tip of iron:300 b max.(25w max) z soldering time: 31sec. ? reflow temp./time: please refer to the following figure
smd sb ? 13.5(.53) 0.2(.008) ? 178(7.0) 1.0(.04) ? 60(2.36) + .5(.0197)/-0 9.0(.35)0.2(.0078) 12.0(.47)0.15(.006)) 0.8 1.6 0.4 cathode mark led die 1.2 0.3 0.6 pcb resin 0.3 0.3 1.0 soldering terminal 0.8 0.8 0.8 0.7 1.0 0.2 0.6 ? package dimensions of device . ? tape specification: 4000pcs per reel. item wp1 e f d0d1p0 unit spec. 8.00 4.00 1.75 3.50 1.50 1.00 4.00 mm 0.32 0.16 0.07 0.14 0.06 0.04 0.16 inches tolerance 0.20 0.10 0.10 0.05 +0.1/-0 0.05 0.05 mm 0.0078 0.004 0.07 0.002 0.004/0 0.002 0.002 inches item 10p0p2a0b0k0 t unit spec. 40.00 2.00 1.85 3.45 1.27 0.22 mm 1.57 0.08 0.07 0.14 0.05 0.01 inches tolerance 0.20 0.05 0.10 0.10 0.10 0.05 mm 0.0078 0.002 0.004 0.004 0.004 0.002 inches ? package dimensions of reel: ? packing and shipping spec. unit:mm(inches) unit:mm(inches) f w cathode d0 p2 p0 b0 d 1 p1 a0 a' a' k0 t sec:a-a' 5 e
smd unit:mm sb sb l1 w1 desiccant antistatic bag zip-lock desiccant spec. spec. spec. 203.0. 198.0 3 $ 5 7 1 2 4
7 < s f v box dimension(cm):30 * 19* 11.5 10 reels per box c/no * : 1 : 0 ( $ 6
& 0 . * 6 . * 6 carton dimension(cm):39*32*38 6boxs/carton 0603b/0603/0805: 4000pcs*10reels*6boxs 0805b/1206b/ 1206 1210 /1204: 3000pcs*10reels*6boxs* 3528:2000pcs*10reels*6boxs 5050:1000pcs*8reels*6boxs
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